Metrology SEM+FIB system
The main purpose of this FIB/SEM equipment is to perform material milling (cutting), 3D characterization, and cross section analysis of epitaxially grown InP, InGaAs, InAlGaAs and InGaAsP layers on InP substrates. The structures may also contain polymer-based planarization layers, SiOx or SiNx dielectric layers and TiPtAu or NiGeAu metal layers. Levering van één SEM +FIB systeem
Buyer
Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
Value
€1,300,000
Published
28 Jul 2026
Closes
7 Sept 2026
Procurement details
Source
TED (EU)
Country
Netherlands (NL)
Procurement method
Open
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
31712000
Microelectronic machinery and apparatus and microsystems
38900000
Miscellaneous evaluation or testing instruments
Lots
Lot LOT-0000 Metal Lift-Off System (TNO44)
Value not provided
Levering van een metal lift-off system Levering van één metal lift-off system
Delivery: Netherlands
Documents
Unlock document linkTED notice 519634-2026
28 Jul 2026
Tender notice · Web page
Procurement documents
Not provided
Bidding documents
Contains information from TED (Tenders Electronic Daily), © European Union, reused under CC BY 4.0.