Silicon Austria Labs – Chips JU: Plasma Activation system for D2W bonding
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a wafer-level plasma activation system for wafer bonding application for Silicon Austria Labs GmbH.
Buyer
Silicon Austria Labs GmbH
Value
€790,621
Published
5 Aug 2026
Closes
Not provided
Procurement details
Source
TED (EU)
Region
AT211
Procurement method
Selective
Category
Goods
Contract starts
7 Jul 2026
Contract ends
Not provided
CPV classifications
38000000
Laboratory, optical and precision equipments (excl. glasses)
Lots
Lot LOT-3075 Silicon Austria Labs – Chips JU: Plasma Activation system for D2W bonding
€790,621
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a wafer-level plasma activation system for wafer bonding application for Silicon Austria Labs GmbH.
Delivery: Villach · AT211 · Austria
Documents
Unlock document linkTED notice 540473-2026
5 Aug 2026
Award notice · Web page
Contains information from TED (Tenders Electronic Daily), © European Union, reused under CC BY 4.0.