Picosecond ultrasonics film thickness measurement tool
Cassette-to-cassette measurement system using picosecond ultrasonics for materials characterization in semiconductor processes, enabling metal thickness metrology, implant monitoring, and thermal conductivity characterization.
Buyer
Teknologian tutkimuskeskus VTT Oy
Value
€1,750,000
Published
4 Aug 2026
Closes
Not provided
Procurement details
Source
TED (EU)
Region
FI1B1
Procurement method
Limited
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
38300000
Measuring instruments
Lots
Lot LOT-0000 Picosecond ultrasonics film thickness measurement tool
€1,750,000
Cassette-to-cassette measurement system using picosecond ultrasonics for materials characterization in semiconductor processes, enabling metal thickness metrology, implant monitoring, and thermal conductivity characterization.
Delivery: Espoo · FI1B1 · Finland
Documents
Unlock document linkTED notice 539615-2026
4 Aug 2026
Award notice · Web page
Contains public sector information licensed under the Open Government Licence v3.0.