Silicon Austria Labs – Laser drilling machine for fan-out wafer level packaging
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a laser drilling machine for fan-out wafer level packaging for Silicon Austria Labs GmbH.
Buyer
Silicon Austria Labs GmbH
Value
€469,747
Published
7 Aug 2026
Closes
Not provided
Procurement details
Source
TED (EU)
Region
AT211
Procurement method
Selective
Category
Goods
Contract starts
5 Jul 2026
Contract ends
Not provided
CPV classifications
38000000
Laboratory, optical and precision equipments (excl. glasses)
Lots
Lot LOT-7273 Silicon Austria Labs – Laser drilling machine for fan-out wafer level packaging
€469,747
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a laser drilling machine for fan-out wafer level packaging as described below for Silicon Austria Labs GmbH.
Delivery: Villach · AT211 · Austria
Documents
Unlock document linkTED notice 549012-2026
7 Aug 2026
Award notice · Web page
Contains information from TED (Tenders Electronic Daily), © European Union, reused under CC BY 4.0.