Flip Chip Die Bonder
In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding.
Buyer
FAIR - Facility for Antiproton and Ion Research in Europe GmbH
Value
€234,757
Published
24 Aug 2026
Closes
22 Sept 2026
Procurement details
Source
TED (EU)
Country
Germany (DE)
Procurement method
Open
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
38000000
Laboratory, optical and precision equipments (excl. glasses)
Lots
Lot LOT-0001 Flip Chip Die Bonder
€234,757
The Flip-chip Die bonder should include the following process modules: - Precision die bonding (face up) - Flip chip bonding (face down) - adapted system work table - chip and substrate heating with process gas enclosure - software-controlled bonding force module - ultrasonic bonding module - in-situ-monitoring with video camera - form generator for creating...
Delivery: Darmstadt · DE711 · Germany
Documents
Unlock document linkTED notice 582477-2026
24 Aug 2026
Tender notice · Web page
Procurement documents
Not provided
Bidding documents
TED notice 667627-2026
29 Sept 2026
Award notice · Web page
Contains information from TED (Tenders Electronic Daily), © European Union, reused under CC BY 4.0.