Plasma etch cluster tool
The object of the procurement is an advanced plasma etch cluster tool to etch metal and thin film layers from 200 mm silicon wafers, as used in the Semiconductor industry. VTT expects a reliable production-worthy tool. The tool should have the capacity for at least four process chambers and other features, which are described below. DIRECT AWARD, Article 40 2(2) of Finnish Procurement act (1397/2016) The procurement will be carried out as a direct award in accordance with 40 article Section 2(2) of the Finnish Publ...
Buyer
Teknologian tutkimuskeskus VTT Oy
Value
Not provided
Published
15 Sept 2026
Closes
Not provided
Procurement details
Source
TED (EU)
Country
Finland (FI)
Procurement method
Limited
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
38000000
Laboratory, optical and precision equipments (excl. glasses)
Lots
Lot LOT-0000 Plasma etch cluster tool
Value not provided
The object of the procurement is an advanced plasma etch cluster tool to etch metal and thin film layers from 200 mm silicon wafers, as used in the Semiconductor industry. VTT expects a reliable production-worthy tool. The tool should have the capacity for at least four process chambers and other features, which are described below. DIRECT AWARD, Article 40...
Delivery: anyw · Anywhere
Documents
Unlock document linkTED notice 634728-2026
15 Sept 2026
Award notice · Web page
Contains information from TED (Tenders Electronic Daily), © European Union, reused under CC BY 4.0.