300 mm D2W hybrid bonding tool (IZM-131.1) - PR1254078-3460-P
300 mm D2W hybrid bonding tool (IZM-131.1)
Buyer
Fraunhofer-Gesellschaft, Einkauf B12
Value
Not provided
Published
3 Aug 2026
Closes
1 Sept 2026
Procurement details
Source
TED (EU)
Country
Germany (DE)
Procurement method
Selective
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
31712100
Microelectronic machinery and apparatus
Lots
Lot LOT-0000 300 mm D2W hybrid bonding tool (IZM-131.1) - PR1254078-3460-P
Value not provided
1x 300 mm D2W hybrid bonding tool (IZM-131.1) The purpose of this equipment specification is to define the requirements for the automated D2W bonding for 2.5D / 3D heterogeneous QMI and chiplet integration, capable to interconnect with +/- 200nm accuracy on 300mm wafer. This equipment is capable of following process steps: 1) Automated Loading and Unloading...
Delivery: Dresden-Moritzburg · DED2E · Germany
Documents
Unlock document linkTED notice 534141-2026
3 Aug 2026
Tender notice · Web page
Procurement documents
Not provided
Bidding documents
Contains information from TED (Tenders Electronic Daily), © European Union, reused under CC BY 4.0.