System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P
System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1)
Buyer
Fraunhofer-Gesellschaft, Einkauf B12
Value
Not provided
Published
20 Jul 2026
Closes
15 Jul 2026
Procurement details
Source
TED (EU)
Country
Germany (DE)
Procurement method
Selective
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
42990000
Miscellaneous special-purpose machinery
Lots
Lot LOT-0000 System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P
Value not provided
1 Piece: System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) A fully automated process tool to be used for plasma etch processes on wafers with a diameter of 300 mm. The systems will be used for the processing of Silicon CMOS wafers in a cleanroom class 1000 (approximately class 6 EN ISO 14644-1) production environmen...
Delivery: Dresden · DED21 · Germany
Documents
Unlock document linkTED notice 498425-2026
20 Jul 2026
Tender notice · Web page
Procurement documents
Not provided
Bidding documents
Contains information from TED (Tenders Electronic Daily), © European Union, reused under CC BY 4.0.