Softwarepaket für den Entwurf von Höchstfrequenz- und Mikrowellenschaltungen
Softwarepaket für den Entwurf von Höchstfrequenz- und Mikrowellenschaltungen
Buyer
IHP GmbH
Value
Not provided
Published
15 Jul 2026
Closes
Not provided
Procurement details
Source
TED (EU)
Region
DE403
Procurement method
Not provided
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
48000000
Software package and information systems
Lots
Lot LOT-0001 Softwarepaket für den Entwurf von Höchstfrequenz- und Mikrowellenschaltungen
Value not provided
The software is an integrated design and verification platform for RF, microwave, RFIC, and advanced packaging applications. It combines circuit-level simulation, 3D electromagnetic (EM) simulation, RFIC design, and system-level verification within a single environment, covering the design flow from transistor-level circuit implementation through communicati...
Delivery: Frankfurt (oder) · DE403 · Germany
Documents
Unlock document linkTED notice 487983-2026
15 Jul 2026
Award notice · Web page
Contains public sector information licensed under the Open Government Licence v3.0.