CMP-System 100/150‑mm‑Wafer (IAF-03) - PR1199438-2050-P
CMP-System 100/150‑mm‑Wafer (IAF-03)
Buyer
Fraunhofer-Gesellschaft, Einkauf B12
Value
Not provided
Published
26 Aug 2026
Closes
Not provided
Procurement details
Source
TED (EU)
Country
Germany (DE)
Procurement method
Open
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
42900000
Miscellaneous general and special-purpose machinery
Lots
Lot LOT-0000 CMP-System 100/150‑mm‑Wafer (IAF-03) - PR1199438-2050-P
Value not provided
"CMP system for the chemical-mechanical polishing of dielectric layers such as silicon oxide on 100 mm and 150 mm Si and III-V semiconductor wafers with integrated cleaning and optical endpoint detection. The purpose of polishing is to achieve surface planarization and improve surface roughness in order to enable subsequent wafer fusion bonding of III-V semi...
Delivery: Freiburg · DE131 · Germany
Documents
Unlock document linkTED notice 589930-2026
26 Aug 2026
Award notice · Web page
Contains information from TED (Tenders Electronic Daily), © European Union, reused under CC BY 4.0.