Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P
Die-to-Wafer Bonder (IPMS-MRS14.1)
Buyer
Fraunhofer-Gesellschaft, Einkauf B12
Value
Not provided
Published
20 Jul 2026
Closes
24 Jul 2026
Procurement details
Source
TED (EU)
Region
DED21
Procurement method
Open
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
42990000
Miscellaneous special-purpose machinery
Lots
Lot LOT-0000 Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P
Value not provided
1 Piece -Die-to-Wafer Bonder (IPMS-MRS14.1) Option 1 (LV Pos. 1.13): Please offer an extended warranty of further 12 months (in total 24 month) Option 2 (LV Pos. 3.6): The tool should handle wafers with the size of (source and target) Option 3 (LV Pos. 3.14): The chiplets can be picked from this type of tray (source) Option 4 (LV Pos. 4.1): The system can be...
Delivery: Dresden · DED21 · Germany
Documents
Unlock document linkTED notice 500022-2026
20 Jul 2026
Tender notice · Web page
Procurement documents
Not provided
Bidding documents
Contains public sector information licensed under the Open Government Licence v3.0.