Fully Automated Wafer Electro Chemical Metal Plating Tool (IZM-140) - PR1163163-3460-P
Fully Automated Wafer Electro Chemical Metal Plating Tool (IZM-140)
Buyer
Fraunhofer-Gesellschaft, Einkauf B12
Value
Not provided
Published
5 Aug 2026
Closes
Not provided
Procurement details
Source
TED (EU)
Region
DED2E
Procurement method
Selective
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
31712100
Microelectronic machinery and apparatus
Lots
Lot LOT-0000 Fully Automated Wafer Electro Chemical Metal Plating Tool (IZM-140) - PR1163163-3460-P
Value not provided
1 System: Fully Automated Wafer Electro Chemical Metal Plating Tool (IZM-140) The following equipment specification defines a fully automated tool for electro chemical deposition (ECD) of different metal layers on wafer substrates. The focus is on high aspect ratio bumps, redistribution layers (RDL) and copper filling of high aspect ratio trough silicon via...
Delivery: Dresden-Moritzburg · DED2E · Germany
Documents
Unlock document linkTED notice 543453-2026
5 Aug 2026
Award notice · Web page
Contains information from TED (Tenders Electronic Daily), © European Union, reused under CC BY 4.0.