DRIE etch cluster (Mainframe + 3 Chambers) (IPMS-MRS07.1; IPMS-MRS07.2; IPMS-MRS08.1; IPMS-MRS08.2) - PR882587-2480-P
DRIE etch cluster (Mainframe + 3 Chambers) (IPMS-MRS07.1; IPMS-MRS07.2; IPMS-MRS08.1; IPMS-MRS08.2)
Buyer
Fraunhofer-Gesellschaft, Einkauf B12
Value
Not provided
Published
20 Jul 2026
Closes
Not provided
Procurement details
Source
TED (EU)
Region
DED21
Procurement method
Selective
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
42990000
Miscellaneous special-purpose machinery
Lots
Lot LOT-0000 DRIE etch cluster (Mainframe + 3 Chambers) (IPMS-MRS07.1; IPMS-MRS07.2; IPMS-MRS08.1; IPMS-MRS08.2) - PR882587-2480-P
Value not provided
1 piece DRIE etch cluster (Mainframe+3 Chambers): MRS07.1: Etching Mainframe MRS07.2: DRIE etching chamber (Chamber1 for deep silicon etching) MRS08.1: Etching module to be integrated into Mainframe MRS07 (chamber 2 for oxide etchuing of thick hardmask MRS08.2: ICP etching module to be integrated into Mainframe MRS07 (chamber 3 for nitride and poly-Si etchun...
Delivery: Dresden · DED21 · Germany
Documents
Unlock document linkTED notice 500959-2026
20 Jul 2026
Award notice · Web page
Contains information from TED (Tenders Electronic Daily), © European Union, reused under CC BY 4.0.