Award of Supply and Delivery of UV Curing System

The University of Strathclyde has a requirement for a bond-interconnect-package line that is suitable to receive semiconductor wafers and/or dies to be packaged in discrete power devices and modules. The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Instit...