Wafer Thinning for The National Manufacturing Institute of Scotland (NMIS)

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. This procurement campaign focuses on the turnkey supply of a wafer laminator, wafer back grinding, wafer polishing and wafer cleaning capability. Estimated value range GBP1.2m-GB...