Supply, Delivery and Installation of Laser Depanelling & Singulation
The University of Strathclyde has a requirement for laser equipment that can depanel printed circuit boards, singulate over moulded lead frames, laser mark components and weld metal lids to metal packages.
Buyer
University of Strathclyde
Value
£825,000
Published
30 Aug 2024
Closes
1 Oct 2024
Procurement details
Source
Pcs
Region
United Kingdom
Procurement method
Open
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
31712330
Semiconductors
Lots
Lot 1 Supply, Delivery and Installation of Laser Depanelling & Singulation
Value not provided
The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging re...
Delivery: UKM82
Documents
Unlock document linkSupply, Delivery and Installation of Laser Depanelling & Singulation
Not provided
The University of Strathclyde has a requirement for laser equipment that can depanel printed circuit boards, singulate over moulded lead frames, laser mark components and weld metal lids to metal packages.
Contract notice · Web page
Supply, Delivery and Installation of Laser Depanelling & Singulation
Not provided
Award notice · Web page
Contains public sector information licensed under the Open Government Licence v3.0.