Supply, Delivery, Installation & Commissioning of Laser Wafer Dicing Equipment
NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support a laser wafer dicing capability along with any and all associated ancillaries required
Buyer
University of Strathclyde
Value
£500,000
Published
1 Nov 2023
Closes
1 Nov 2023
Procurement details
Source
Pcs
Region
UKM82
Procurement method
Not provided
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
31712330
Semiconductors
31710000
Electronic equipment
Lots
Lot 1 Supply, Delivery, Installation & Commissioning of Laser Wafer Dicing Equipment
Value not provided
NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the fa...
Delivery: UKM82
Documents
Unlock document linkSupply, Delivery, Installation & Commissioning of Laser Wafer Dicing Equipment
Not provided
NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is fle...
Planned procurement notice · Web page
Contains public sector information licensed under the Open Government Licence v3.0.