Wafer Dicing Saw
Tenders should demonstrate that the supplier possesses a comprehensive process library and clearly show the ability to cut glass, quartz, sapphire, silicon and SiC substrates. Tenders should address how a 1 mm thick, 150 mm square glass substrates can be diced.
Buyer
University of St Andrews
Value
Not provided
Published
12 Apr 2023
Closes
26 Apr 2023
Procurement details
Source
Pcs
Region
UKM72
Procurement method
Open
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
43812000
Sawing equipment
Lots
Lot 1 Wafer Dicing Saw
Value not provided
Tenders should demonstrate that the supplier possesses a comprehensive process library and clearly show the ability to cut glass, quartz, sapphire, silicon and SiC substrates. Tenders should address how a 1 mm thick, 150 mm square glass substrates can be diced.
Delivery: UKM72
Documents
Unlock document linkWafer Dicing Saw
Not provided
Tenders should demonstrate that the supplier possesses a comprehensive process library and clearly show the ability to cut glass, quartz, sapphire, silicon and SiC substrates. Tenders should address how a 1 mm thick, 150 mm square glass sub...
Contract notice · Web page
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