Supply, Delivery and Installation of a Wafer Dicing Saw
The Department of Physics at the University of Strathclyde requires a wafer dicing saw. The wafer dicing saw will be used primarily for dicing 150 mm diameter wafer stacks of glass and silicon.
Buyer
University of Strathclyde
Value
£55,000
Published
6 Mar 2019
Closes
4 Feb 2019
Procurement details
Source
Pcs
Region
UKM82
Procurement method
Open
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
51430000
Installation services of laboratory equipment
Lots
Lot 1 Supply, Delivery and Installation of a Wafer Dicing Saw
£57,000
The Department of Physics at the University of Strathclyde requires a wafer dicing saw. The wafer dicing saw will be used primarily for dicing 150 mm diameter wafer stacks of glass and silicon.
Delivery: UKM82
Documents
Unlock document linkSupply, Delivery and Installation of a Wafer Dicing Saw
Not provided
The Department of Physics at the University of Strathclyde requires a wafer dicing saw. The wafer dicing saw will be used primarily for dicing 150 mm diameter wafer stacks of glass and silicon.
Contract notice · Web page
Supply, Delivery and Installation of a Wafer Dicing Saw
Not provided
The Department of Physics at the University of Strathclyde requires a wafer dicing saw. The wafer dicing saw will be used primarily for dicing 150 mm diameter wafer stacks of glass and silicon.
Award notice · Web page
Contains public sector information licensed under the Open Government Licence v3.0.