Chip Cleave & Break system
The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser diode cleaving resulting in high quality mirror facets, bar to die separation and die singulation. The tool must be capable of automatic processing or manual mode operation, must be capable of handling up to 150mm wafers at least as well as small pieces or tiles of a wafer and m...
Buyer
CARDIFF UNIVERSITY
Value
£200,000
Published
26 Aug 2022
Closes
26 Sept 2022
Procurement details
Source
Sell2Wales
Region
Cardiff and Vale of Glamorgan
Procurement method
Open
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
38000000
Laboratory, optical and precision equipments (excl. glasses)
Lots
Lot 1 Chip Cleave & Break system
Value not provided
The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser diode cleaving resulting in high quality mirror facets, bar to die separation and die singulation. The tool must be cap...
Delivery: Cardiff and Vale of Glamorgan
Documents
Unlock document linkChip Cleave & Break system
Not provided
The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser...
Contract notice · Web page
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