Lapping and Polishing Machine
A lapping and polishing machine capable of thin wafers up to 200mm in diameter
Buyer
CARDIFF UNIVERSITY
Value
£200,000
Published
27 Oct 2022
Closes
21 Jun 2022
Procurement details
Source
Sell2Wales
Region
Cardiff and Vale of Glamorgan
Procurement method
Open
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
38000000
Laboratory, optical and precision equipments (excl. glasses)
Lots
Lot 1 Lapping and Polishing Machine
£197,057
Cardiff University is looking for a new lapping and polishing tool to thin wafers up to 200mm in diameter in a variety of materials such as Gallium Arsenide, Indium Phosphide, silicon, and silicon carbide. The University encourages bids from suppliers that have experience of supplying lapping and polishing machines to organisations of a similar nature in the...
Delivery: Cardiff and Vale of Glamorgan
Documents
Unlock document linkLapping and Polishing Machine
Not provided
A lapping and polishing machine capable of thin wafers up to 200mm in diameter
Contract notice · Web page
Lapping and Polishing Machine
Not provided
A lapping and polishing machine capable of thin wafers up to 200mm in diameter
Award notice · Web page
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