Supply of a Wafer Cleaving System
This Tender was for the supply and installation of a wafer cleaving system.Funding for this procurement has been secured from the Application Specific Semiconductor Etching Technology (ASSET) project via the Welsh Government’s SMARTExpertise Program, which is funded through the European Regional Development Fund (ERDF).
Buyer
Swansea University
Value
Not provided
Published
26 Aug 2022
Closes
26 Aug 2022
Procurement details
Source
Sell2Wales
Region
Swansea
Procurement method
Not provided
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
No CPV codes are available for this public record.
Lots
Lot default Supply of a Wafer Cleaving System
Value not provided
This Tender was for the supply and installation of a wafer cleaving system.Funding for this procurement has been secured from the Application Specific Semiconductor Etching Technology (ASSET) project via the Welsh Government’s SMARTExpertise Program, which is funded through the European Regional Development Fund (ERDF).
Documents
No document metadata is available for this public record.
Contains public sector information licensed under the Open Government Licence v3.0.