Supply and Installation of iBond 5000 Wedge Bonder System with Microscope and Bonding Accessories

Supply of an iBond 5000 manual ultrasonic wedge bonder for microelectronics and semiconductor packaging applications, including an Olympus stereo zoom microscope, deep-access wire and ribbon bonding clamp assemblies, heated workholder, ribbon spool holder, and related accessories. The contract also includes installation, commissioning, and operational training for users at NPL.