Sub-Micron Die Bonder
We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems.
Buyer
UNIVERSITY OF SHEFFIELD
Value
£380,000
Published
9 Dec 2025
Closes
9 Dec 2025
Procurement details
Source
Find a Tender
Region
Sheffield
Procurement method
Not provided
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
38000000
Laboratory, optical and precision equipments (excl. glasses)
Lots
Lot 1 Sub-Micron Die Bonder
Value not provided
Delivery: UKE32 · United Kingdom
Documents
Unlock document linkPreliminary market engagement notice on Find a Tender
9 Dec 2025
Preliminary market engagement notice on Find a Tender
Market engagement notice · UK2 · Web page
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