UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.
Buyer
UK Research & Innovation (UKRI)
Value
£180,000
Published
15 Feb 2024
Closes
19 Jan 2024
Procurement details
Source
Find a Tender
Region
Swindon
Procurement method
Open
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
31712000
Microelectronic machinery and apparatus and microsystems
Lots
Lot 1 UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components
£180,000
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.
Delivery: Oxfordshire
Documents
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