Wafer Dicing Saw and Post Wafer Cleaning
The University of Southampton seeks to acquire a complete dicing system for the University's optical and semiconductor materials processing capabilities for a number of high-impact projects in the major engineering themes of Quantum Technologies, Photonics and Advanced Manufacturing. This system is a replacement for the current dicing saw for Building 53 back-end of line cleanroom facility and an upgrade to meet the demands of current projects and technologies. Dicing is a fundamental part of the cleanroom and unde...
Buyer
University of Southampton
Value
£205,000
Published
15 Dec 2023
Closes
10 Jan 2024
Procurement details
Source
Find a Tender
Region
Southampton
Procurement method
Open
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
38000000
Laboratory, optical and precision equipments (excl. glasses)
Lots
Lot 1 Wafer Dicing Saw and Post Wafer Cleaning
£205,000
The University of Southampton seeks to acquire a complete dicing system for the University's optical and semiconductor materials processing capabilities for a number of high-impact projects in the major engineering themes of Quantum Technologies, Photonics and Advanced Manufacturing. This system is a replacement for the current dicing saw for Building 53 bac...
Delivery: Southampton
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