Laser Sealing
NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support a laser based lidding and sealing capability along with any and all associated ancillaries required.
Buyer
University of Strathclyde
Value
£485,000
Published
8 Sept 2023
Closes
8 Sept 2023
Procurement details
Source
Find a Tender
Region
UKM82
Procurement method
Not provided
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
38636000
Specialist optical instruments
Lots
Lot 1 Laser Sealing
Value not provided
NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the fa...
Delivery: UKM82
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