Laser Dicing and Drilling System
Scope The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules, and systems. The facility enables research, proof of concept and provides the capability to demonstrate the feasibility and undertake small volume prototype builds. The system is not for mass production and high edge quality is a target from dicing and drilling processes. As a part of the package a...
Buyer
COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED
Value
£350,000
Published
18 Aug 2021
Closes
31 Aug 2021
Procurement details
Source
Find a Tender
Region
Wales
Procurement method
Open
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
38000000
Laboratory, optical and precision equipments (excl. glasses)
Lots
Lot 1 Laser Dicing and Drilling System
Value not provided
The estimated value of the contract is £250,000 to £350,000 including goods to meet the requirements, user software, installation, training, options and extensions. The system will must be invoiced before the end of December 2021 delivered in January 2022. To express interest in this opportunity and receive the procurement documents, please email [contact em...
Delivery: Wales
Documents
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