Open Tenderocds-h6vhtk-02d648

Laser Dicing and Drilling System

Scope The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules, and systems. The facility enables research, proof of concept and provides the capability to demonstrate the feasibility and undertake small volume prototype builds. The system is not for mass production and high edge quality is a target from dicing and drilling processes. As a part of the package a...

Buyer

COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED

Value

£350,000

Published

18 Aug 2021

Closes

31 Aug 2021

Procurement details

Source

Find a Tender

Region

Wales

Procurement method

Open

Category

Goods

Contract starts

Not provided

Contract ends

Not provided

CPV classifications

38000000

Laboratory, optical and precision equipments (excl. glasses)

Lots

Lot 1 Laser Dicing and Drilling System

Value not provided

The estimated value of the contract is £250,000 to £350,000 including goods to meet the requirements, user software, installation, training, options and extensions. The system will must be invoiced before the end of December 2021 delivered in January 2022. To express interest in this opportunity and receive the procurement documents, please email [contact em...

Delivery: Wales

Documents

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Contains public sector information licensed under the Open Government Licence v3.0.