Supply of Semiconductor Dicing and Grinding Systems
This Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System. These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility. This requirement is split into two separate lots
Buyer
Swansea University
Value
£350,000
Published
8 Nov 2021
Closes
24 Aug 2021
Procurement details
Source
Find a Tender
Region
Swansea
Procurement method
Open
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
38000000
Laboratory, optical and precision equipments (excl. glasses)
Lots
Lot 1 Wafer Dicing System
£80,000
This Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System. These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be condu...
Delivery: Swansea, Bridgend and Neath Port Talbot, Monmouthshire and Newport
Lot 2 Wafer Grinding System
£250,000
This procurement is for the supply and installation of a Wafer Grinding System. This will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility. Additional informa...
Delivery: Monmouthshire and Newport
Documents
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