Metal 3D Printer
Scope The Compound Semiconductor Applications (CSA) Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow research, proof of concept and demonstrate its feasibility and small volume prototype build. As part of the electronics package assembly research and development methodology we require a machine that can produce customised prototype metal parts using additive m...
Buyer
COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED
Value
£350,000
Published
25 May 2021
Closes
13 May 2021
Procurement details
Source
Find a Tender
Region
Wales
Procurement method
Open
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
38000000
Laboratory, optical and precision equipments (excl. glasses)
Lots
Lot 1 Metal 3D Printer
£350,000
To express interest in this opportunity and receive the procurement documents, please email [contact email hidden] with the reference ICT-2020-046 in the subject field. Additional information: To express interest in this opportunity and receive the procurement documents, please email [contact email hidden] with the reference ICT-2020-046 in the subject field...
Delivery: Wales
Documents
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