Open Tenderocds-h6vhtk-02ac1f

Metal 3D Printer

Scope The Compound Semiconductor Applications (CSA) Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow research, proof of concept and demonstrate its feasibility and small volume prototype build. As part of the electronics package assembly research and development methodology we require a machine that can produce customised prototype metal parts using additive m...

Buyer

COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED

Value

£350,000

Published

25 May 2021

Closes

13 May 2021

Procurement details

Source

Find a Tender

Region

Wales

Procurement method

Open

Category

Goods

Contract starts

Not provided

Contract ends

Not provided

CPV classifications

38000000

Laboratory, optical and precision equipments (excl. glasses)

Lots

Lot 1 Metal 3D Printer

£350,000

To express interest in this opportunity and receive the procurement documents, please email [contact email hidden] with the reference ICT-2020-046 in the subject field. Additional information: To express interest in this opportunity and receive the procurement documents, please email [contact email hidden] with the reference ICT-2020-046 in the subject field...

Delivery: Wales

Documents

No document metadata is available for this public record.

Contains public sector information licensed under the Open Government Licence v3.0.