Semi-Automatic Wire Bonder

The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly research and development methodology we are looking to increase our capacity with wire bonding. We currently have a Hesse BJ653 with five bondheads to provide t...