Provision of a Wafer Level Electroplating Unit

The Zepler Institute (ZI), University of Southampton, plans to purchase a wafer level-electroplating tool for use in state of the art wafer scale fabrication research. The tool is intended to perform Back-end-of-line wafer fabrication processes and research including the fabrication of interconnects and Through Silicon Vias. Additional uses of the tool to undertake wafer scale packaging processes is highly desirable. The fabrication facility offers industry-compatible fabrication processing including 150mm and 200m...