Die Bonder
The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly research and development methodology we require a machine to perform die bonding on to package, module and PCB boards. The bonding equipment shall allow manual...
Buyer
COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED
Value
£0
Published
26 Jul 2019
Closes
7 May 2019
Procurement details
Source
Contracts Finder
Region
United Kingdom
Procurement method
Open
Category
Goods
Contract starts
19 Jun 2019
Contract ends
19 Jun 2022
CPV classifications
38000000
Laboratory, optical and precision equipments (excl. glasses)
Lots
Lot default Die Bonder
£180,000
The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly...
Delivery: British Oversea Territories, Channel Islands, Europe, Isle of Man, Rest of the World, United Kingdom
Documents
Unlock document linkOpportunity notice on Contracts Finder
5 Apr 2019
Opportunity notice on Contracts Finder
Tender notice · Web page
Awarded contract notice on Contracts Finder
26 Jul 2019
Awarded contract notice on Contracts Finder
Award notice · Web page
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