UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.
Buyer
UK Research & Innovation (UKRI)
Value
£250,000
Published
15 Feb 2024
Closes
13 Feb 2024
Procurement details
Source
Contracts Finder
Region
Swindon
Procurement method
Other
Category
Goods
Contract starts
15 Feb 2024
Contract ends
30 Jul 2024
CPV classifications
31712000
Microelectronic machinery and apparatus and microsystems
Lots
Lot default UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components
£250,000
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.
Delivery: South East · United Kingdom, South East, United Kingdom
Documents
Unlock document linkAwarded contract notice on Contracts Finder
15 Feb 2024
Awarded contract notice on Contracts Finder
Award notice · Web page
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Tender notice
Contains public sector information licensed under the Open Government Licence v3.0.