Printed-Circuit-Board (PCB) Manufacturing Equipment
Scope of Requirement 1.1 A multi-layer press 1.1.1 To enable us to produce PCBs with more than two layers 1.2 A semi-automatic pick and place machine 1.2.1 To assemble PCBs with 0201 passives and fine-pitch ICs 1.3 Application of solder resist and idents to PCBs 1.3.1 To provide a protective coating and resistive layer to the outside layers of PCBs, and to enable the location of the components to be marked onto the PCBs. 1.4 A reflow oven 1.4.1 To allow the assembly of PCBs which contain components impossible to ot...
Buyer
Government Commercial Agency
Value
Not provided
Published
18 Nov 2016
Closes
22 Apr 2016
Procurement details
Source
Contracts Finder
Region
East of England
Procurement method
Open
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
31712000
Microelectronic machinery and apparatus and microsystems
Lots
Lot default Printed-Circuit-Board (PCB) Manufacturing Equipment
Value not provided
Scope of Requirement 1.1 A multi-layer press 1.1.1 To enable us to produce PCBs with more than two layers 1.2 A semi-automatic pick and place machine 1.2.1 To assemble PCBs with 0201 passives and fine-pitch ICs 1.3 Application of solder resist and idents to PCBs 1.3.1 To provide a protective coating and resistive layer to the outside layers of PCBs, and to e...
Delivery: East of England · United Kingdom, East of England, United Kingdom
Documents
Unlock document linkOpportunity notice on Contracts Finder
14 Apr 2016
Opportunity notice on Contracts Finder
Tender notice · Web page
Appendix F - Supplier Guidance Part A
Not provided
Appendix F - Supplier Guidance Part A
Application/pdf · PDF
Contains public sector information licensed under the Open Government Licence v3.0.