GB-LIVERPOOL: Manual Die Placement System for Glueing & Bump Bonding

Tender for the supply of a die bonding system suitable for the glueing of silicon dies with epoxy and filled anisotropically conductive glues as well as for bump bonding with Indium, PbZn and AgZn solder balls. The system will be housed in the Liverpool Semiconductor Detector Centre (LSDC), Department of Physics, University of Liverpool. Additional information: The contracting authority considers that this contract may be suitable for economic operators that are small or medium enterprises (SMEs). However, any sele...