UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.
Buyer
BIP SOLUTIONS LIMITED
Value
£1
Published
21 Feb 2024
Closes
19 Jan 2024
Procurement details
Source
Contracts Finder
Region
United Kingdom
Procurement method
Open
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
31712000
Microelectronic machinery and apparatus and microsystems
Lots
Lot default UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components
£1
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.
Delivery: South East · United Kingdom, South East, United Kingdom
Documents
Unlock document linkOpportunity notice on Contracts Finder
21 Feb 2024
Opportunity notice on Contracts Finder
Tender notice · Web page
Please follow this link to view the notice.
Not provided
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Tender notice
Contains public sector information licensed under the Open Government Licence v3.0.