Supply, Delivery and Installation of Power Semiconductor Reliability Testing Equipment
Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semico...
Buyer
University of Strathclyde
Value
£1,000,000
Published
20 Jul 2026
Closes
19 Aug 2026
Procurement details
Source
Pcs
Region
UKM82
Procurement method
Open
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
38000000
Laboratory, optical and precision equipments (excl. glasses)
Lots
Supply, Delivery and Installation of Power Semiconductor Reliability Testing Equipment
Lot 1
Value not provided
This tender is to ensure that the devices packaged by the facility or our clients meet industry standards, the facility is planning to procure three reliability testing equipment/systems as follows: (1) Climatic chamber 1 for high temperature bias test, (2) Climatic chamber 2 for high temperature and high humidity bias test, (3) Thermal shock test chamber.
Delivery: UKM82
Document metadata
Supply, Delivery and Installation of Power Semiconductor Reliability Testing Equipment
Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semicondu...
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