Die Bonding System
Funding is available to purchase a die attach/bonding system capable of performing a wide range of bonding processes, including ultrasonic, flip-chip, and UV curing, which is suitable for prototyping and light production runs. As a result, a crucial aspect for any die attach system under is the ability to be used for bonding runs as small as a single die should this be required. This stipulation lends itself to a semi-automated (i.e. motorised) system, ideally with the capacity to store process recipes to maximise...
Buyer
University of Bristol
Value
£215,000
Published
1 Jul 2026
Closes
16 Jul 2026
Procurement details
Source
Contracts Finder
Region
United Kingdom
Procurement method
Open
Category
Goods
Contract starts
Not provided
Contract ends
Not provided
CPV classifications
38000000
Laboratory, optical and precision equipments (excl. glasses)
Lots
Lot default Die Bonding System
£215,000
Funding is available to purchase a die attach/bonding system capable of performing a wide range of bonding processes, including ultrasonic, flip-chip, and UV curing, which is suitable for prototyping and light production runs. As a result, a crucial aspect for any die attach system under is the ability to be used for bonding runs as small as a single die sho...
Delivery: British Oversea Territories, Channel Islands, Europe, Isle of Man, Rest of the World, United Kingdom
Documents
Unlock document linkOpportunity notice on Contracts Finder
1 Jul 2026
Opportunity notice on Contracts Finder
Tender notice · Web page
Link to eSourcing Portal
Not provided
Link to eSourcing Portal
Document
Contains public sector information licensed under the Open Government Licence v3.0.